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Process development of double bump flip chip with enhanced reliability and finite element analysis

Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/226970399
Date January 2005
CreatorsYan, Wei, Johnson, R. Wayne,
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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