Process development of double bump flip chip with enhanced reliability and finite element analysis

Description

Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.

Links & Downloads

1. http://repo.lib.auburn.edu/2005%20Summer/doctoral/YAN_WEI_15.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/226970399
Date	January 2005
Creators	Yan, Wei, Johnson, R. Wayne,
Publisher	Auburn, Ala. ,
Source Sets	OCLC
Language	English
Detected Language	English