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In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests

Thesis (Ph. D.)--School of Mechanical Engineering, Georgia Institute of Technology, 2004. Directed by Daniel F. Baldwin. / Vita. Includes bibliographical references (leaves 202-210).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/54942040
Date January 2003
CreatorsZhang, Jian,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology, 2004:

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