Return to search

Study on the curing process of no-flow and wafer level underfill for flip-chip applications

Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/54938192
Date January 2003
CreatorsZhang, Zhuqing,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology, 2004:

Page generated in 0.0017 seconds