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Fouling in silicon microchannel designs used for IC chip cooling and its mitigation /

Thesis (Ph.D.)--Rochester Institute of Technology, 2008. / Typescript. Includes bibliographical references (leaves 170-176).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/223433253
Date January 2008
CreatorsPerry, Jeffrey L.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceOnline version of thesis

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