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Atomic Layer Deposition of Boron Oxide and Boron Nitride for Ultrashallow Doping and Capping Applications

The deposition of boron oxide (B₂O₃) films on silicon substrates is of significant interest in microelectronics for ultrashallow doping applications. However, thickness control and conformality of such films has been an issue in high aspect ratio 3D structures which have long replaced traditional planar transistor architectures. B₂O₃ films are also unstable in atmosphere, requiring a suitable capping barrier for passivation. The growth of continuous, stoichiometric B₂O₃ and boron nitride (BN) films has been demonstrated in this dissertation using Atomic Layer Deposition (ALD) and enhanced ALD methods for doping and capping applications.
Low temperature ALD of B₂O₃ was achieved using BCl₃/H₂O precursors at 300 K. In situ x-ray photoelectron spectroscopy (XPS) was used to assess the purity and stoichiometry of deposited films with a high reported growth rate of ~2.5 Å/cycle. Free-radical assisted ALD of B₂O₃ was also demonstrated using non-corrosive trimethyl borate (TMB) precursor, in conjunction with mixed O₂/O-radical effluent, at 300 K. The influence of O₂/O flux on TMB-saturated Si surface was investigated using in situ XPS, residual gas analysis mass spectrometer (RGA-MS) and ab initio molecular dynamics simulations (AIMD). Both low and high flux regimes were studied in order to understand the trade-off between ligand removal and B₂O₃ growth rate. Optimization of precursor flux was discovered to be imperative in plasma and radical-assisted ALD processes.
BN was investigated as a novel capping barrier for B₂O₃ and B-Si-oxide films. A BN capping layer, deposited using BCl₃/NH₃ ALD at 600 K, demonstrated excellent stoichiometry and consistent growth rate (1.4 Å/cycle) on both films. Approximately 13 Å of BN was sufficient to protect ~13 Å of B₂O₃ and ~5 Å of B-Si-oxide from atmospheric moisture and prevent volatile boric acid formation. BN/B₂O₃/Si heterostructures are also stable at high temperatures (>1000 K) commonly used for dopant drive-in and activation. BN shows great promise in preventing upward boron diffusion which causes a loss in the dopant dose concentration in Si.
The capping effects of BN were extended to electrochemical battery applications. ALD of BN was achieved on solid Li-garnet electrolytes using halide-free tris(dimethylamino)borane precursor, in conjunction with NH₃ at 723 K. Approximately 3 nm of BN cap successfully inhibited Li₂CO₃ formation, which is detrimental to Li-based electrolytes. BN capped Li-garnets demonstrated ambient stability for at least 2 months of storage in air as determined by XPS. BN also played a crucial role in stabilizing Li anode/electrolyte interface, which drastically reduced interfacial resistance to 18 Ω.cm², improved critical current density and demonstrated excellent capacitance retention of 98% over 100 cycles. This work established that ALD is key to achieving conformal growth of BN as a requirement for Li dendrite suppression, which in turn influences battery life and performance.

Identiferoai:union.ndltd.org:unt.edu/info:ark/67531/metadc1752373
Date12 1900
CreatorsPilli, Aparna
ContributorsKelber, Jeffry, Marshall, Paul, Du, Jincheng, Verbeck, Guido, Arava, Leela
PublisherUniversity of North Texas
Source SetsUniversity of North Texas
LanguageEnglish
Detected LanguageEnglish
TypeThesis or Dissertation
Formatxiii, 140 pages, Text
RightsPublic, Pilli, Aparna, Copyright, Copyright is held by the author, unless otherwise noted. All rights Reserved.

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