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Multigrid methods for parameter identification in heat conduction systems.

Chan Kai Yam. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2001. / Includes bibliographical references (leaves 80-82). / Abstracts in English and Chinese. / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Parameter Identification in Heat Conduction Systems --- p.1 / Chapter 1.2 --- Inverse Problems --- p.3 / Chapter 1.3 --- Challenges in Inverse Problems --- p.6 / Chapter 2 --- Tools in Parameter Identification --- p.9 / Chapter 2.1 --- Output Least Squares Method --- p.10 / Chapter 2.2 --- Tikhonov Regularization --- p.11 / Chapter 2.3 --- Our Approach --- p.14 / Chapter 3 --- Numerical Implementations --- p.20 / Chapter 3.1 --- Finite Element Discretization and Its Convergence --- p.20 / Chapter 3.2 --- Steepest Descent Method --- p.22 / Chapter 3.3 --- Multigrid Techniques --- p.26 / Chapter 4 --- Numerical Experiments --- p.29 / Chapter 4.1 --- One Dimensional Examples --- p.30 / Chapter 4.1.1 --- Selection of mk --- p.31 / Chapter 4.1.2 --- Selection of nk --- p.34 / Chapter 4.1.3 --- Selection of Number of Levels in the Coarse Grid Correction Step --- p.37 / Chapter 4.1.4 --- Convergence with Different Regularization Pa- rameters γ --- p.39 / Chapter 4.1.5 --- Convergence with Different Initial Guesses --- p.42 / Chapter 4.1.6 --- Comparisons between MG and SG Methods --- p.44 / Chapter 4.1.7 --- Comparisons between MG and RMG Methods --- p.46 / Chapter 4.1.8 --- More Examples --- p.49 / Chapter 4.1.9 --- Coarse Grid Correction in Another Approach --- p.60 / Chapter 4.2 --- Two Dimensional Examples --- p.71 / Chapter 4.3 --- Conclusions --- p.78 / Bibliography --- p.80

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_323521
Date January 2001
ContributorsChan, Kai Yam., Chinese University of Hong Kong Graduate School. Division of Mathematics.
Source SetsThe Chinese University of Hong Kong
LanguageEnglish, Chinese
Detected LanguageEnglish
TypeText, bibliography
Formatprint, iv, 82 leaves : ill. ; 30 cm.
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

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