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The Study on the Measurement of Out-of-Plane Displacement of an Object Subjected to Both Temperature and Displacement Field by Using the Holographic Interferometry

The main aim of this study is to extending the holographic interferometry technique to measure the out-of-plane displacement of an object subjected to both temperature and displacement field. It is noted that both the out-of-plane displacement and the ambient temperature change can cause image fringes. Therefore, an auxiliary object is used to identify the fringe numbers caused by the ambient temperature change during the experiment. The warpage measurement of a PBGA package is used as an example. It can be shown that the proposed method works

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0517101-172512
Date17 May 2001
CreatorsTsai, Ming-Lang
ContributorsYii-Tay Chiou, Ting-Lang Hsiao, Chi-Hui Chien
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0517101-172512
Rightsunrestricted, Copyright information available at source archive

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