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Interconnect technology for three-dimensional chip integration

Zugl.: Ulm, Univ., Diss., 2007

  1. http://d-nb.info/986311502/04
Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/227006897
Date January 2007
CreatorsMunding, Andreas
PublisherGöttingen Cuvillier
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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