These thesis deals with electromigration in solder joint. In theoretical part are described lead-free solders, surface finish, formation of solder joint, intermetallic compounds a electromigration. In practical part is investigated a effect of electromigration on growth intermetallic compounds in solder jsoint.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:218867 |
| Date | January 2011 |
| Creators | Paško, Martin |
| Contributors | Švecová, Olga, Stejskal, Petr |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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