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Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

No description available.

1. http://hdl.handle.net/1853/18228
2. 623099

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/18228
Date	08 1900
Creators	Park, Ji Eun
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.