One of the most important electrical requirements in high performance electronic systems or high speed integrated circuits, is to process larger numbers of electrical signals at much higher speeds. Signal propagation delay must be minimized in order to maximize signal velocities. Therefore, material with low dielectric constant and low dissipation factor is being sought. In this thesis research measurements of dielectric constant and dissipation factor were performed on commercially available polyimides that are used in multilayer interconnect structures. Capacitor structures with a polyimide dielectric were measured up to a 1GHz frequency and 220°C temperature. Polyimides were concluded to be compatible for use in high performance systems such as multilayer interconnect structures.
| Identifer | oai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/276497 |
| Date | January 1987 |
| Creators | Hinedi, Mohamad Fahd, 1964- |
| Publisher | The University of Arizona. |
| Source Sets | University of Arizona |
| Language | en_US |
| Detected Language | English |
| Type | text, Thesis-Reproduction (electronic) |
| Rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. |
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