Atomic layer deposition and properties of refractory transition metal-based copper-diffusion barriers for ULSI interconnect

Description

Thesis (Ph. D.)--University of Texas at Austin, 2003. / Supervisors: J. G. Ekerdt and J. M. White. Vita. Includes bibliographical references. Available also from UMI Company.

Links & Downloads

1. http://wwwlib.umi.com/cr/utexas/fullcit?p3119636
2. http://repositories.lib.utexas.edu/bitstream/handle/2152/1104/lemondsam039.pdf

Tags

Integrated circuits Tantalum.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/57367498
Date	January 2003
Creators	Lemonds, Andrew Michael, Ekerdt, John G., White, John M.,
Source Sets	OCLC
Language	English
Detected Language	English