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Fatigue modeling of nano-structured chip-to-package interconnections

Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Rao R. Tummala; Committee Co-Chair: Ashok Saxena; Committee Member: Karl Jacob; Committee Member: Suresh Sitaraman; Committee Member: Thomas H. Sanders, Jr.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/456233315
Date January 2009
CreatorsKoh, Sau W.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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