Abstract
The interface crack of an IC package is easily existed under vibration, high temperature or collision. Its reliability will be reduced significantly for the existence of the crack. This study, therefore, is to investigate the fracture mechanism of the underfill/substrate interface with different crack length.
In this study, mixed mode fracture of the underfill/substrate interface, was investigated by single lap tension test. Based on the load-displacement curve, J integral, energy release rate and stress intensity factor were calculated. Moreover, the relationships among the stress intensity facto KI, KII and phase angle were also derived.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0822103-145648 |
| Date | 22 August 2003 |
| Creators | Huang, Ming-Yeong |
| Contributors | none, none, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0822103-145648 |
| Rights | withheld, Copyright information available at source archive |
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