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Modeling of stresses and deformation in thin film and interconnect line structures

No description available.
Identiferoai:union.ndltd.org:UPSALLA/oai:DiVA.org:kth-3224
Date January 2001
CreatorsWikström, Adam
PublisherKTH, Solid Mechanics, Stockholm : Hållfasthetslära
Source SetsDiVA Archive at Upsalla University
LanguageEnglish
Detected LanguageEnglish
TypeDoctoral thesis, comprehensive summary, text
RelationTrita-HFL, 1104-6813 ; 0294

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