Abstract
The effect of joint strength of PbSn and AuSn solder on temperature cycling tests in laser packages has been studied experimentally and numerically. It was found that the solder joint strength increased as temperature cycle number increased, and then became steady after 400 cycles. This is may be due to the redistribution of the residual stresses within the solder during temperature cycling test, and hence reducing the residual stresses and increasing the solder joint as the temperature cycle increased. Numerical calculations were in good agreement with the experimental measurement that the solder joint strength increased as the temperature cycle increased. In this work, we also study the intermetallic compound (IMC) growth of PbSn and AuSn solders under cycling test and aging test. The thickness of IMC growth do not significantly increase under cycling test, because the cycling test temperature was from ¡V40 to 85ºC. However, under the high temperature aging of 200ºC for 25 days, the IMC thickness was increased to 4.71£gm.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0702100-231952 |
| Date | 02 July 2000 |
| Creators | Chen, Chia-Cheng |
| Contributors | Wood-Hi Cheng, Tien-Tsorng Shih, Szu-Chun Wang, Ker-Chang Hsieh, Jao-Hwa Kuang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0702100-231952 |
| Rights | campus_withheld, Copyright information available at source archive |
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