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Vliv množství pájky a izotermálního stárnutí na vodivost pájeného spoje / Solder Joint Conductivity - Influence of Solder Volume and Isothermal Aging

The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part. Simulated BGA package with four pin (BGA4) is used for experiments. Tested PCBs are subjected to isothermal aging and current load. During isothermal aging is measured electrical conductivity and optical microscope is used for intermetallic layer (IMC) growth observation. Two types of surface finish (OSP and ENIG) are used for tests and three diameters of solder terminal balls (solder alloy SAC405). The influence of the ratio area connection / solder volume (ratio S / V) on lead-free solder joints conductivity was evaluated.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:219521
Date January 2012
CreatorsMach, Ladislav
ContributorsSchnederle, Petr, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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