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Thermal fatigue of Cu thin films

Zugl.: Stuttgart, University, Diss., 2004.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/76732496
Date January 2005
CreatorsMönig, Reiner.
PublisherStuttgart : Max-Planck-Inst. für Metallforschung,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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