The modification of polyimide films by tin-complex incorporation has been studied with the aim of producing materials with the mechanical and thermal properties of polyimide with enhanced electrical properties. A variety of Sn(II) and Sn(IV) complexes have been incorporated into BTDA/ODA (3,3 14,4 1-benzophenonetetracarboxylic acid dianhydride / 4,41- oxydianiline) and PMDA/ODA (pyromellitic dianhydride/4,4 1 -oxydianiline) derived polyimides in a 1:4 (complex/polymer repeat unit) molar ratio. Tin-complex incorporation was seen to have a variety of effects upon polyimide properties, depending upon the particular tin-complex employed. All films produced were thermally stable with decomposition temperatures> 500°C. Most films were homogeneous and flexible. / Master of Science
| Identifer | oai:union.ndltd.org:VTETD/oai:vtechworks.lib.vt.edu:10919/44468 |
| Date | 28 August 2003 |
| Creators | Ezzell, Stephen A. |
| Contributors | Chemistry, Taylor, Larry T., Harris, Paul J., McGrath, James E. |
| Publisher | Virginia Tech |
| Source Sets | Virginia Tech Theses and Dissertation |
| Detected Language | English |
| Type | Thesis, Text |
| Format | viii, 94 pages, 2 unnumbered leaves, BTD, application/pdf, application/pdf |
| Rights | In Copyright, http://rightsstatements.org/vocab/InC/1.0/ |
| Relation | OCLC# 10774687, ezzell.pdf |
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