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Ultraviolet Bonding of Diamond Abrasive Tools for Lap-Grinding Process

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Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:toledo1354572460
Date January 2012
CreatorsGuo, Lei
PublisherUniversity of Toledo / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=toledo1354572460
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

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