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Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process

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1. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696

Identifer	oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:272696
Date	January 2002
Creators	Horsley, Robert Michael
Publisher	University of Salford
Source Sets	Ethos UK
Detected Language	English
Type	Electronic Thesis or Dissertation