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The kinetics of tin solidification in lead-free solder joints

Thesis (M.S.)--State University of New York at Binghamton, Department of Physics, 2006. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/184739002
Date January 2006
CreatorsKirkpatrick, Timothy.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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