Due to the introduction of Restriction of Hazardous Substances (RoHS) directive Pb containing solders have been banned from the electronics industry and a reliable replacement for the Sn-Pb solder is being sought for by industry around the globe. Medical and Defense industries are currently exempt from the directive and use Sn-Pb solder in their manufacturing process. The switch to lead-free has led component manufacturers to use different lead-free solders, thus causing mixed solder joints of lead-free components with Sn-Pb paste. In this study, mixed assembly microstructures and mechanical properties were examined. Furthermore, six novel lead-free solders were prepared using SAC105 solder doped with elements: Ti, Ni, Mn, La, Ce and Y. The solidification microstructures, fracture behavior and wetting properties of these solders were evaluated to find a suitable replacement for SAC105 solder.
Identifer | oai:union.ndltd.org:LACETR/oai:collectionscanada.gc.ca:OTU.1807/30652 |
Date | 08 December 2011 |
Creators | Kaila, Rishi |
Contributors | Perovic, Doug |
Source Sets | Library and Archives Canada ETDs Repository / Centre d'archives des thèses électroniques de Bibliothèque et Archives Canada |
Language | en_ca |
Detected Language | English |
Type | Thesis |
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