Solderability & microstructure of lead-free solder in leadframe packaging

Description

Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

Links & Downloads

1. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf
2. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert-r.pl?msc-ap-b21175214f.pdf

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/71776371
Date	January 2005
Creators	Woo, Belemy Hok Chung.
Source Sets	OCLC
Language	English
Detected Language	English
Source	access abstract and table of contents access full-text