The goal of this thesis is to work out an introduction to the chip packaging and decapsulation. Further can be found a description of a method leading to dacapsulate concrete chips. Final part is devoted to getting chip pictures using microscope and analysis of the pictures afterwards.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:237016 |
| Date | January 2011 |
| Creators | Malčík, Dominik |
| Contributors | Hanáček, Petr, Drahanský, Martin |
| Publisher | Vysoké učení technické v Brně. Fakulta informačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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