Aerogels are highly porous, low dielectric constant (low k) materials being considered by the semiconductor industry as an interlayer dielectric. Low k materials are needed to overcome capacitance problems that limit device feature sizes. Precursors triethoxyfluorosilane (TEFS) and tetraethoxysilane (TEOS) were used to prepare bulk aerogels. Samples were prepared by sol-gel methods, and then carbon dioxide supercritically-dried. Effects of varying the water to precursor ratio were studied with respect to aerogel properties and microstructure. Methods of analysis for this study include FTIR-ATR, TEM, RBS, EDS, SEM, dielectric constant determination by impedance and surface area by gas adsorption. Si-F bonds were determined to be present in both acid- and base-catalyzed TEFS as well as HF-catalyzed TEOS. Fluorine promotes a fractal network microstructure as opposed to a particle-like microstructure. Surface area and dielectric constant were determined to increase slightly with increases in the water to precursor ratio.
Identifer | oai:union.ndltd.org:unt.edu/info:ark/67531/metadc2999 |
Date | 12 1900 |
Creators | Roepsch, Jodi Ann |
Contributors | Reidy, Richard, Brostow, Witold, 1934-, D'Souza, Nandika A., Gnade, Bruce |
Publisher | University of North Texas |
Source Sets | University of North Texas |
Language | English |
Detected Language | English |
Type | Thesis or Dissertation |
Format | Text |
Rights | Use restricted to UNT Community, Copyright, Roepsch, Jodi Ann, Copyright is held by the author, unless otherwise noted. All rights reserved. |
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