The first part of this thesis studies the wire-bonding technology for use in an integrated design of transformer balun and RF front-end receiver, which is realized by IPD and CMOS technology, respectively. In this part, the RF front-end receiver and the balun were designed separately, and the bondwire model was established based on electromagnetic simulation. For the maximum power transfer and optimal noise performance, the input impedance between the CMOS RF front-end receiver and the IPD balun was conjugate-matched. The IPD balun, placed in front of the differential LNA of a direct-conversion receiver, is designed using the IPD technology, thereby reducing the insertion loss, and subsequently improving the noise figure of the CMOS receiver. The second part of this thesis uses a vertically coupled transformer balun with a primary coil made by IPD technology and a secondary coil made by CMOS technology. This balun has a low-loss advantage when integrated with a posterior differential LNA. Finally, the magnetic resonance coupling for use in signal transmission is studied and experimented on a printed circuit board.
Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0719111-135952 |
Date | 19 July 2011 |
Creators | Lee, Cheng-Tse |
Contributors | Sheng-Fuh Chang, Tzyy-Sheng Horng, Jian-Ming Wu, Huey-Ru Chuang, Lih-Tyng Hwang |
Publisher | NSYSU |
Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
Language | Cholon |
Detected Language | English |
Type | text |
Format | application/pdf |
Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0719111-135952 |
Rights | withheld, Copyright information available at source archive |
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