The conventional techniques of manufacturing large-size structures in a very large plate pose severe challenges in making microstructures. In contrast, semiconductor process that employs lithographic processes to form micro scale features is limited in its wafer size.
In ordre to modify the defeat of shadow mask. This thesis propose to use TMAH anisotropic wet etching process and 2D- joining technique to fabricate silicon shadow mask. The potential of this technique would be significant for a very large plate beyond a wafer size with microstructures, and provides a new approach with a high replication and potentially low cost.
In the numerical analysis, this study uses the finite element software, ANSYS, to simulate shadow mask with different size, material, and temperature displacement situation.
The results shows the feasibility of silicon shadow mask used in the thermal evaporation process. It indicates that this design could have smoother pattern and reduce the limitation of Organic Light-Emitting Diode resolution.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0716107-214832 |
| Date | 16 July 2007 |
| Creators | Huang, Chin-yen |
| Contributors | Yang, Shiuh-Kuang, Hwang, Jen-Jyh, Yang, Ru |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0716107-214832 |
| Rights | not_available, Copyright information available at source archive |
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