The development of a polyimide and metals multi-user surface micro-machining
process for Micro-electro-mechanical Systems (MEMS) is presented. The process was
designed to be as general as possible, and designed to be capable to fabricate different
designs on a single silicon wafer. The process was not optimized with the purpose
of fabricating any one specific device but can be tweaked to satisfy individual needs
depending on the application.
The fabrication process uses Polyimide as the structural material and three separated
metallization layers that can be interconnected depending on the desired application.
The technology allows the development of out-of-plane compliant mechanisms,
which can be combined with six variations of different physical principles for
actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing,
thermocouple-based sensing and radio frequency transmission and reception.
| Identifer | oai:union.ndltd.org:kaust.edu.sa/oai:repository.kaust.edu.sa:10754/621944 |
| Date | 11 1900 |
| Creators | Carreno, Armando Arpys Arevalo |
| Contributors | Foulds, Ian G., Kosel, Jürgen, Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division, Younis, Mohammad I., Bohringer, Karl |
| Source Sets | King Abdullah University of Science and Technology |
| Language | English |
| Detected Language | English |
| Type | Dissertation |
| Rights | 2017-12-06, At the time of archiving, the student author of this dissertation opted to temporarily restrict access to it. The full text of this dissertation became available to the public after the expiration of the embargo on 2017-12-06. |
Page generated in 0.0024 seconds