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A Novel Packaging for MEMS-Based Pressure Sensors

This dissertation proposes a novel packaging methodology for micro-electro-mechanical systems (MEMS) based pressure sensors by using a patterned ultra-thick (150

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0708109-171206
Date08 July 2009
CreatorsChen, Lung-tai
ContributorsChin-Ting Lee, Shiuh Chao, Gong-Ru Lin, Hao-Chung Kuo, Wen-Yao Huang, Wood-Hi Cheng, An-Kuo Chu, Meng-Chyi Wu, Chia-Yen Lee
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageEnglish
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0708109-171206
Rightsrestricted, Copyright information available at source archive

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