This thesis proposed a near-field electromagnetic interference measurement framework to obtain sensitivity and spatial resolution of the characteristic parameters of magnetic probe based on International Electrotechnical Commission proposed for integrated circuits electromagnetic radiation measurement standards IEC 61967-6 : magnetic probe method. Using cross-coupled planar microwave bandpass filter which is realized by glass fiber board (FR4) for near-field measurement and electromagnetic simulation in comparsion. Nowadays, integrated circuits has become an important source of energy of overall electromagnetic interference in electronic systems. Finally, do near-field scanning measurement for a 64-pin wire-bond quad flat nonlead (WB-QFN) package and the voltage-controlled oscillator chip in 0.18 £gm CMOS technology by using high scanning resolution of microprobe. Then observes the chip-level and package-level electromagnetic interference, and achieve chip-level of near-field electromagnetic interference measurement techniques.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0808112-141615 |
| Date | 08 August 2012 |
| Creators | Hsieh, Hsin-Feng |
| Contributors | Chia-Chan Chang, Lih-Tyng Hwang, Tzyy-Sheng Horng, Sheng-Fuh Chang, Chia-Chan Chang, Lih-Tyng Hwang, Huey-Ru Chuang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0808112-141615 |
| Rights | user_define, Copyright information available at source archive |
Page generated in 0.0019 seconds