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Failure mechanisms in VLSI bonds subjected to mechanical and environmental stresses

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1. 297727
2. http://hdl.handle.net/1853/30523

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/30523
Date	05 1900
Creators	Maguire, Dawn Laurel
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis