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Low temperature transient liquid phase bonding for electronic packaging

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. / Includes bibliographical references (leaf 50) / by Michelle M. Hou. / M.S.

Identiferoai:union.ndltd.org:MIT/oai:dspace.mit.edu:1721.1/60735
Date January 1992
CreatorsHou, Michelle M. (Michelle Ming-Jan)
ContributorsThomas W. Eagar., Massachusetts Institute of Technology. Dept. of Materials Science and Engineering
PublisherMassachusetts Institute of Technology
Source SetsM.I.T. Theses and Dissertation
LanguageEnglish
Detected LanguageEnglish
TypeThesis
Format50 leaves, application/pdf
RightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission., http://dspace.mit.edu/handle/1721.1/7582

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