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Microstructure and mechanical properties of bamboo in compression

Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2012. / Cataloged from PDF version of thesis. / Includes bibliographical references (p. 34). / Bamboo has received much interest recently as a construction material due to its strength, rapid growth, and abundance in developing nations such as China, India, and Brazil. The main obstacle to the widespread use of bamboo as a structural material is the lack of adequate information on the mechanical properties of bamboo. In this work, the microstructure and mechanical properties of Phyllostachis dulcis bamboo are studied to help produce a model for the mechanical properties of bamboo. Specifically, a linear relationship is established between the density of bamboo samples, which is known to vary radially, and their strength in compression. Nanoindentation of vascular bundles in various positions in bamboo samples revealed that the Young's modulus and hardness of the bundles vary in the radial direction but not around the circumference. The compressive strength of bamboo samples was found to vary from 40 to 95 MPa, while nanoindentation results show the Young's modulus of vascular bundles ranges from 15 to 18 GPa and the hardness ranges from 380 to 530 MPa. / by Michael R. Gerhardt. / S.B.

Identiferoai:union.ndltd.org:MIT/oai:dspace.mit.edu:1721.1/76122
Date January 2012
CreatorsGerhardt, Michael R
ContributorsLorna J. Gibson., Massachusetts Institute of Technology. Dept. of Materials Science and Engineering., Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
PublisherMassachusetts Institute of Technology
Source SetsM.I.T. Theses and Dissertation
LanguageEnglish
Detected LanguageEnglish
TypeThesis
Format34 p., application/pdf
RightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission., http://dspace.mit.edu/handle/1721.1/7582

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