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Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects

Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992. / Includes bibliographical references (leaves 246-262). / by Hai Pham Longworth. / Sc.D.

Identiferoai:union.ndltd.org:MIT/oai:dspace.mit.edu:1721.1/13114
Date January 1992
CreatorsLongworth, Hai Pham
ContributorsCarl V. Thompson., Massachusetts Institute of Technology. Dept. of Materials Science and Engineering
PublisherMassachusetts Institute of Technology
Source SetsM.I.T. Theses and Dissertation
LanguageEnglish
Detected LanguageEnglish
TypeThesis
Format262 leaves, 19103536 bytes, 19103293 bytes, application/pdf, application/pdf, application/pdf
RightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission., http://dspace.mit.edu/handle/1721.1/7582

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