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A study of plated through-hole reliability of formaldehyde-based electroless copper depositions in multi-layer board production

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1. 436877
2. http://hdl.handle.net/1853/32803

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/32803
Date	08 1900
Creators	Sleboda, Thomas James
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis