<p> Adhesive bonding is a common, robust, and inexpensive method of joining materials. Of particular interest is the behavior under shear loading, where adhesive bonding excels compared to alternative joining methods. However, while the quasi-static response of these joints is well understood, the dynamic behavior is largely unknown. </p><p> To this end, a series of experiments were devised and performed where two bars are adhesively bonded using a simple lap joint and subjected to a high-speed impact from a steel slug. These tests were configured to, as much as possible, isolate the type of wave that generates adhesive shear and minimize the effect of reflected and induced waves. While keeping the overall geometry constant, the adhesive material, substrate material, and projectile velocity were varied. </p><p> The wave behavior was recorded using surface-mounted strain gages. Also, digital image correlation techniques were developed to analyze high-speed video of the impact event. From these experiments, a number of useful measures can be extracted, including the critical input (projectile) kinetic energy and the specific energy absorbed by the adhesive. </p><p> The techniques developed in this thesis allow for the suitability of different substrate/adhesive combinations under ballistic shear impact to be quantitatively evaluated. </p><p> Additionally, dynamic plate theory is used to derive an analytical model of the substrate/adhesive system. Several solutions to this model which were solved using a Finite Difference approach are included. These solutions were then compared to the strain histories recorded in the physical experiments. </p><p>
| Identifer | oai:union.ndltd.org:PROQUEST/oai:pqdtoai.proquest.com:10743329 |
| Date | 08 June 2018 |
| Creators | Chiu, Jack |
| Publisher | The City College of New York |
| Source Sets | ProQuest.com |
| Language | English |
| Detected Language | English |
| Type | thesis |
Page generated in 0.0024 seconds