The periodic silane burst technique was employed during metalorganic chemical vapor deposition of epitaxial GaN on AlN buffer layers grown on Si (111). Periodic silicon delta doping during growth of both the AlN and GaN layers led to growth of GaN films with decreased tensile stresses and decreased threading dislocation densities, as well as films with improved quality as indicated by x-ray diffraction, micro-Raman spectroscopy, atomic force microscopy, and transmission electron microscopy. The possible mechanism of the reduction of tensile stress and the dislocation density is discussed in the paper. / Singapore-MIT Alliance (SMA)
Identifer | oai:union.ndltd.org:MIT/oai:dspace.mit.edu:1721.1/7362 |
Date | 01 1900 |
Creators | Zang, Keyan, Chua, Soo-Jin, Thompson, Carl V. |
Source Sets | M.I.T. Theses and Dissertation |
Language | English |
Detected Language | English |
Type | Article |
Format | 595081 bytes, application/pdf |
Relation | Advanced Materials for Micro- and Nano-Systems (AMMNS); |
Page generated in 0.0019 seconds