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Comparison of 43Sn/43Pb/14Bi Solder and Standard 60Sn/40Pb Solder by Thermocyclic Fatigue Analysis

The thermocyclic fatigue behavior of the low-melting solder 43Sn/43Pb/14Bi has been investigated and compared to that of standard 60Sn/4OPb solder via metallographic analysis (using scanning electron microscopy) and evaluation of the degree of fatigue development (using a fatigue scale as a function of thermocycles). Specimens were subjected to shearing strains imposed by several hundred fatigue thermocycles. Both solder types fatigue by the same microstructural failure mechanism as described by other workers. The mechanism is characterized by a preferential coarsening of the solder joint microstructure at the region of maximum stress concentration where cracks originate.

Identiferoai:union.ndltd.org:unt.edu/info:ark/67531/metadc501128
Date08 1900
CreatorsCalderon, Jose Guadalupe
ContributorsMarshall, James L., 1940-, Daugherty, Kenneth E., Pinizzotto, Russell F.
PublisherUniversity of North Texas
Source SetsUniversity of North Texas
LanguageEnglish
Detected LanguageEnglish
TypeThesis or Dissertation
Formatix, 108 leaves : ill., Text
RightsPublic, Copyright, Calderon, Jose Guadalupe, Copyright is held by the author, unless otherwise noted. All rights reserved.

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