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Stress and microstructure of sputter deposited thin copper and niobium films

Zugl.: Stuttgart, University, Diss., 2003.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/76556844
Date January 2003
CreatorsOkolo, Brando Chidi.
PublisherStuttgart : Max-Planck-Inst. für Metallforschung,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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