Return to search

Finite Element Modeling and Validation of a Novel Process for Extruding Thin Wall Hollow Copper Profiles

No description available.
Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:ohiou1327333357
Date18 April 2012
CreatorsLaing, Jeffrey M.
PublisherOhio University / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=ohiou1327333357
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

Page generated in 0.0016 seconds