Understanding adhesion issues at underfill - passivation interfaces /

Description

Thesis (Ph. D.)--Lehigh University, 2005. / Includes vita. Includes bibliographical references (leaves 170-187).

Links & Downloads

1. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3167069

Tags

Adhesion. Microelectronic packaging.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/62457351
Date	January 2005
Creators	McAdams, Brian J.,
Source Sets	OCLC
Language	English
Detected Language	English
Type	Academic dissertations