Comparison of thermal fatigue reliability between SAC and SnPb solders under various stress range conditions /

Description

Includes bibliographical references (p. 80-84).

Links & Downloads

1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202009%20YANGC

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/641144783
Date	January 2009
Creators	Yang, Chaoran.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View abstract or full-text.