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Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references (leaves 278-290).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/311858385
Date January 2008
CreatorsRamkumar, S. Manian.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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