Finite element analysis of three-dimensional corner stress singularities and its application in microelectronics packaging /

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Thesis (Ph. D.)--Lehigh University, 2002. / Includes bibliographica references and vita.

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/51056591
Date	January 2002
Creators	Xu, Anqing,
Source Sets	OCLC
Language	English
Detected Language	English
Type	Academic dissertations