Cure behavior of epoxy polymers used in microelectronics /

Description

Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).

Links & Downloads

1. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:9995567

Tags

Epoxy resins. Microelectronic packaging.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/47236062
Date	January 2000
Creators	Taweeplengsangsuke, Jantrawan,
Source Sets	OCLC
Language	English
Detected Language	English
Type	Academic dissertations