Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip chip packages /

Description

Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.

Links & Downloads

1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20SHAM

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/52054143
Date	January 2003
Creators	Sham, Man-Lung.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View Abstract or Full-Text.