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Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications

Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Rao R. Tummala; Committee Member: C. P. Wong; Committee Member: P. M. Raj.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/268988116
Date January 2008
CreatorsJha, Gopal Chandra.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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