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A theoretical framework for the dynamic analysis of a printed wiring board under mechanical and thermal loading

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1. http://hdl.handle.net/1853/16615
2. 590566

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16615
Date	12 1900
Creators	He, Xiaoling
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.