Analysis of a mechanical punching process to create registration holes on a continuous roll-to-roll flexible electronics substrates using SPC techniques

Description

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.

Links & Downloads

1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/1456520

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/314666896
Date	January 2008
Creators	Yepez, Denisse E.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Electronic books. Electronic dissertations.
Source	Online access via UMI: